ECP 505 Is supplied ready for use, it is designed to give low resistance in thin film thickness, and exhibits excellent EMI shielding and grounding propertiesdisplaying excellent adhesion to most plastics and is ideal for electronic equipment housing. It exhibits excellent long term shielding and grounding properties while providing an aesthetically pleasing appearance.
PHYSICAL PROPERTIES
Surface resistance at 25 micron
thou) ASTM D257 0.5 ohm/square or less
Conductive additive Silver plated copper
Viscosity 16 – 18 sec. (zahn cup 2)
Flash Point – 5C
Specific Gravity 1.050g /cm3
Typical coverage 5 m2/kg at 25 microns(dependent on substrate)
TYPICAL PROPERTIES
Sheet resistance – <0.50 /square at 25 m
Attenuation – 75 dB at 50 m
Maximum service temperature 95C













